Resistive-switching nonvolatile memory elements

ABSTRACT

Nonvolatile memory elements are provided comprising switching metal oxides. The nonvolatile memory elements may be formed in one or more layers on an integrated circuit. Each memory element may have a first conductive layer, a metal oxide layer, and a second conductive layer. Electrical devices may be coupled in series with the memory elements. The first conductive layer may be formed from a metal nitride. The metal oxide layer may contain the same metal as the first conductive layer. The metal oxide may form an ohmic contact or a Schottky contact with the first conductive layer. The second conductive layer may form an ohmic contact or a Schottky contact with the metal oxide layer. The first conductive layer, the metal oxide layer, and the second conductive layer may include sublayers. The second conductive layer may include an adhesion or barrier layer and a workfunction control layer.

This application is a Divisional application of U.S. patent applicationSer. No. 12/114,667 entitled “Resistive-Switching Nonvolatile MemoryElements” filed on May 2, 2008 now U.S. Pat. No. 8,144,498 and claimingpriority to provisional patent application No. 60/928,648, filed May 9,2007, both of which are hereby incorporated by reference herein in theirentirety.

BACKGROUND

This invention relates to nonvolatile memory elements formed fromresistive-switching metal oxides.

Such nonvolatile memory elements are used in systems in which persistentstorage is required. For example, digital cameras use nonvolatile memorycards to store images and digital music players use nonvolatile memoryto store audio data. Nonvolatile memory is also used to persistentlystore data in computer environments.

As device dimensions shrink, scaling issues are posing challenges forthe manufacture of traditional nonvolatile memory technologies. This hasled to the investigation of alternative nonvolatile memory technologies,including resistive switching nonvolatile memory.

Resistive switching nonvolatile memory is formed using memory elementsthat have two or more stable states with different resistances. Bistablememory has two stable states. A bistable memory element can be placed ina high resistance state or a low resistance state by application ofsuitable voltages or currents. Voltage pulses are typically used toswitch the memory element from one resistance state to the other.Nondestructive read operations can be performed to ascertain the valueof a data bit that is stored in a memory cell.

Resistive switching based on metal oxide switching elements has beendemonstrated. However, such switching elements often exhibit at leastone of i) insufficiently high resistances for the “high” (i.e. “off”)and/or “low” (i.e. “on”) states, ii) insufficiently low off state and/orreset currents, iii) poor switching behavior, iv) poor electricaldistribution, v) low yield, vi) poor thermal stability, and/or vii) poorreliability to be of use in practical devices.

It would therefore be desirable to be able to form high qualityresistive switching nonvolatile memory elements that address at leastsome of these areas and perhaps others.

SUMMARY

In accordance with the present invention, nonvolatile resistiveswitching memory elements for integrated circuits such as memory arraysare formed. The nonvolatile memory elements may each have a firstconductive layer, a resistive-switching metal oxide layer, and a secondconductive layer. The nonvolatile memory elements may be stacked inlayers to form a stacked memory array.

The metal oxide may be formed using metals such as transition metals.Dopant may be added to the metal oxide.

The first conductive layer may be formed from a metal nitride. The metalnitride may be a binary or ternary metal nitride and may include morethan one metal. The most prevalent metal in the metal nitride is thesame as the most prevalent metal in the metal oxide layer.

The second conductive layer may include i) an (optional)adhesion/barrier layer and ii) a workfunction control layer formed froma high workfunction metal (e.g., platinum, iridium, palladium, nickel,rhenium, rhodium, etc.) or metal compound (e.g. iridium oxide, rutheniumoxide, titanium aluminum nitride, etc.).

The metal oxide may form an ohmic contact or Schottky contact with thefirst conductive layer. The second conductive layer may form an ohmiccontact or Schottky contact with the metal oxide layer. Preferably, thefirst or second conductive layer forms an ohmic contact with the metaloxide and the opposing contact forms a Schottky contact with the metaloxide.

In one preferred embodiment, the first conductive layer is a metalnitride wherein the most prevalent metal in the metal nitride is thesame as the most prevalent metal in the metal oxide layer and said firstconductive layer forms an ohmic contact with the metal oxide, while thesecond conductive layer forms a Schottky contact with the metal oxide.In another embodiment, the aforementioned second conductive layer isformed from a high workfunction metal (e.g., platinum, iridium,palladium, nickel, rhenium, rhodium, etc.) or metal compound (e.g.iridium oxide, ruthenium oxide, titanium aluminum nitride, etc.). Inanother embodiment, the aforementioned metal oxide isnon-stoichiometric.

Further features of the invention, its nature and various advantageswill be more apparent from the accompanying drawings and the followingdetailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram of an illustrative array of resistive switchingmemory elements in accordance with an embodiment of the presentinvention.

FIG. 2A is a cross-sectional view of an illustrative resistive switchingnonvolatile memory element in accordance with an embodiment of thepresent invention.

FIG. 2B is a cross-sectional view of an illustrative resistive switchingnonvolatile memory element in accordance with another embodiment of thepresent invention.

FIG. 3 is a graph showing how resistive switching nonvolatile memoryelements of the types shown in FIGS. 2A and 2B may exhibit bistablebehavior in accordance with an embodiment of the present invention.

FIG. 4 is a schematic diagram of an illustrative resistive switchingmemory element in series with a diode in accordance with an embodimentof the present invention.

FIG. 5 is a schematic diagram of an illustrative resistive switchingmemory element in series with an electrical device in accordance with anembodiment of the present invention.

FIG. 6 is a schematic diagram of an illustrative resistive switchingmemory element in series with two electrical devices in accordance withan embodiment of the present invention.

FIG. 7 is a cross-sectional diagram of an illustrative stacked memorycontaining multiple layers of resistive switching nonvolatile memoryelements in accordance with an embodiment of the present invention.

FIG. 8 is a flow chart of illustrative steps involved in formingresistive switching memory elements for nonvolatile memory devices inaccordance with an embodiment of the present invention.

DETAILED DESCRIPTION

Embodiments of the present invention relate to nonvolatile memory formedfrom resistive switching elements. Embodiments of the invention alsorelate to resistive switching nonvolatile memory element structures andfabrication methods that may be used to form such structures.

Resistive switching elements may be formed on any suitable type ofintegrated circuit. Most typically, resistive switching memory elementsmay be formed as part of a high-capacity nonvolatile memory integratedcircuit. Nonvolatile memory integrated circuits are often used inportable devices such as digital cameras, mobile telephones, handheldcomputers, and music players. In some arrangements, a nonvolatile memorydevice may be built into mobile equipment such as a cellular telephone.In other arrangements, nonvolatile memory devices are packaged in memorycards or memory keys that can be removably installed in electronicequipment by a user.

The use of resistive switching memory elements to form memory arrays onmemory devices is merely illustrative. In general, any suitableintegrated circuit may be formed using the resistive switchingstructures of the present invention. Fabrication of memory arrays formedof resistive switching memory elements is described herein as anexample.

An illustrative memory array 10 of nonvolatile resistive switchingmemory elements 12 is shown in FIG. 1. Memory array 10 may be part of amemory device or other integrated circuit. Read and write circuitry isconnected to memory elements 12 using conductors 16 and orthogonalconductors 18. Conductors such as conductors 16 and conductors 18 aresometimes referred to as word lines and bit lines and are used to readand write data into the elements 12 of array 10. Individual memoryelements 12 or groups of memory elements 12 can be addressed usingappropriate sets of conductors 16 and 18. Memory elements 12 may beformed from one or more layers of materials, as indicated schematicallyby lines 14 in FIG. 1. In addition, memory arrays such as memory array10 can be stacked in a vertical fashion to make multilayer memory arraystructures.

During a read operation, the state of a memory element 12 can be sensedby applying a sensing voltage to an appropriate set of conductors 16 and18. Depending on its history, a memory element that is addressed in thisway may be in either a high resistance state (i.e. “off” state) or a lowresistance state (i.e. “on” state). The resistance of the memory elementtherefore determines what digital data is being stored by the memoryelement. If the memory element has a high resistance, for example, thememory element may be said to contain a logic one (i.e., a “1” bit). If,on the other hand, the memory element has a low resistance, the memoryelement may be said to contain a logic zero (i.e., a “0” bit). During awrite operation, the state of a memory element can be changed byapplication of suitable write signals to an appropriate set ofconductors 16 and 18.

A cross-section of an illustrative embodiment of a resistive switchingnonvolatile memory element is shown in FIG. 2A. In the example of FIG.2A, memory element 12 is formed from a metal oxide 22 and has conductiveelectrodes 20 and 24. When constructed as part of an array such as array10 of FIG. 1, conductive lines such as lines 16 and 18 may be physicallyand electrically connected to electrodes 20 and 24. Such conductivelines may be formed from metals or other conductive materials (e.g.,tungsten, aluminum, copper, metal silicides, doped polysilicon, dopedsilicon, combinations of these materials, etc.). If desired, conductiveline 16 and conductive line 18 may serve as both conductive lines and aselectrodes. In this type of arrangement, line 16 may serve as electrode20, so that no separate conductor is needed to form an upper electrodefor element 12. Similarly, line 18 may serve as electrode 24, so that noseparate conductor is needed for the lower electrode of element 12.

In the diagram of FIG. 2A, conductive lines 16 and 18 are shownschematically as being formed in contact with electrodes 20 and 24.Other arrangements may be used if desired. For example, there may beintervening electrical components (e.g., diodes, p-i-n diodes, silicondiodes, silicon p-i-n diodes, transistors, etc.) that are formed betweenline 16 and electrode 20 or between line 18 and electrode 24.

Metal oxide layer 22 may be formed from a single layer of material orfrom multiple sublayers of material. As shown by dotted line 23, forexample, metal oxide 22 may be formed from metal oxide sublayer 22A andmetal oxide sublayer 22B. There may, in general, be any suitable numberof sublayers in metal oxide 22 (e.g., three or more sublayers, four ormore sublayers, etc.). The depiction of two sublayers in FIG. 2A ismerely illustrative.

Each sublayer in metal oxide 22 may be formed using a differentfabrication process and/or different materials. For example, sublayers22A and 22B may be formed by oxidizing a conductive layer 24 that isformed from titanium nitride. The resulting sublayers 22B and 22A mayhave compositions of Ti_(x1)O_(y1)N_(z1) and Ti_(x2)O_(y2)N_(z2),respectively. The value of z2 may be much less than the value of z1(e.g., ten or more times less). In this type of scenario, the sublayers22B and 22A of metal oxide layer 22 contain nitrogen. Most of layer 22(i.e., layer 22A) will generally not contain nitrogen in any significantquantity, but one or more associated sublayers (such as sublayer 22B)may be nitrogen rich. If desired, layers such as layers 22A and 22B maybe deposited using sputtering techniques (as an example). Duringsputtering, gas pressures may be varied continuously or discretely toproduce layers with continuously varying or discretely varyingcompositions.

Sublayers such as sublayers 22A and 22B may have any suitablethicknesses. For example, sublayers 22A and 22B may have layerthicknesses of 5-150 angstroms, 20-250 angstroms, 50-2000 angstroms,etc.

If desired, there may be a series-connected electrical component betweenone of the conductive layers of device 12 and the resistive switchingmetal oxide. An illustrative arrangement in which there is anintervening electrical component 38 between conductor 24 and metal oxide22 is shown in FIG. 2B.

As indicated schematically by dotted lines 21, conductive materials forstructures such as electrodes 24 and 20 may be formed from one or morelayers of materials. These layers may include adhesion layers, barrierlayers, and workfunction control layers (as examples).

An adhesion layer may have a thickness of, for example, about 5 to 50angstroms and may be formed directly in contact with metal oxide layer22 to promote adhesion of other layers to metal oxide layer 22. Somematerials such as high workfunction noble materials (e.g., Pt) do notalways adhere well when formed directly in contact with metal oxidelayer 22. The presence of an adhesion layer in this type of situationmay help the high work function layer to adhere. Adhesion layers may beformed form any suitable materials. As an example, an adhesion layer maybe formed from titanium, tantalum, or tungsten, and any of theirnitrides, carbides, silicides, and/or combinations thereof.

A barrier layer may be used to prevent interdiffusion between thematerials that form the conductive electrode of element 12 and thematerials in metal oxide layer 22. The barrier layer may be formed ofany suitable material. The barrier layer may have a thickness of about5-1000 angstroms (as an example), but preferably from about 5 to 50angstroms. The barrier layer may also serve as an adhesion layer.Examples of barrier layers include refractory metal (e.g. titanium,tantalum, tungsten, etc.) nitrides, carbides, carbon nitrides, and/orsilicon nitrides. In an element 12 that has separate adhesion andbarrier layers, the adhesion layer may be formed in contact with metaloxide layer 22 and the barrier layer may be formed in contact with theadhesion layer.

A workfunction control layer is a layer of material (e.g., metal) thateffectively determines the workfunction of an electrode on metal oxidelayer 22. The workfunction control layer may be formed on metal oxide 22or may be formed on an adhesion and/or barrier layer. The workfunctioncontrol layer may have a high workfunction (e.g., greater than 4.5 eV or5.0 eV). In the case when the workfunction control layer is used inconjunction with an adhesion layer and/or barrier layer, it ispreferable that the thickness of the adhesion layer, barrier layer orthe sum of the adhesion and barrier layers is less than or equal to 100angstroms, and more preferably less than or equal to 50 angstroms sothat the workfunction control layer still remains the primary layer forsetting the effective workfunction of the electrode on the metal oxidelayer. The work function control layer is typically approximately 50angstroms or greater in thickness.

Examples of materials that may be used to form electrodes 20 and 24include metals (e.g., refractory or transition metals), metal alloys,metal nitrides (e.g., refractory metal nitrides), metal silicon nitrides(i.e., materials containing refractory metals, transition metals, orother metals, along with silicon and nitrogen), metal carbides, metalcarbon nitrides, metal silicides, or other conductors. The metalnitrides used for electrodes 20 and 24 may be binary nitrides (i.e.,Me_(x)N_(y), where Me is a metal), ternary nitrides (e.g.,Me1_(x)Me2_(y)N_(z), where Me1 and Me2 are metals), or other suitablenitrides.

Metal oxide 22 may be formed from a metal oxide such as a transitionmetal oxide, e.g., cobalt-based, nickel-based, copper-based, zinc-based,titanium-based, zirconium-based, hafnium-based, vanadium-based,niobium-based, tantalum based, chromium-based, molybdenum-based,tungsten-based, or manganese-based oxides or other oxides such asaluminum-based oxides. One or more dopants may be incorporated intometal oxide 22. Examples of dopants that may be incorporated into metaloxide 22 include but are not limited to Ti, Ni, Co, Zr, V, Al, and Nb.

In general, electrodes 20 and 24 and metal oxide 22 may each contain oneor more metals. The metal that is present in the largest atomicconcentration in a given layer is herein referred to as the mostprevalent metal in that layer.

It has been found that improved non-volatile switching behavior(including but not limited to yield and stability) can be achieved whenthe first electrode 24 or second electrode 20 forms an ohmic contactwith metal oxide 22. Moreover, it is preferable that the electrodeopposite the ohmic contact is chosen to form a Schottky contact with themetal oxide 22. Preferably, the metal oxide 22 is chosen to benon-stoichiometric (e.g., by including but not being limited to metaldeficient, metal rich, oxygen deficient, or oxygen rich materials) toenable defects (e.g., including but not being limited to metalvacancies, metal interstitials, oxygen vacancies, or oxygeninterstitials) and/or charge carriers to form in the metal oxide.

In addition, it is desirable to choose an electrode layer that isthermally stable (e.g. does not agglomerate, de-wet, delaminate, etc.)and does not negatively react with the metal oxide during subsequentprocessing steps (e.g. during silicon-based diode formation, dopantactivation, etc. wherein processing temperatures can exceed 500° C. and700° C., respectively).

Choosing one of the electrodes to be a metal nitride (e.g. Me_(x)N_(y)),metal silicon nitride (e.g. Me_(x)Si_(y)N_(z)) or metal carbon nitride(e.g. Me_(x)C_(y)N_(z)) where the most prevalent metal in the electrodeis the same as the most prevalent metal in a non-stoichiometric metaloxide 22 can enable the formation of a thermally stable, ohmic orSchottky contact with good switching characteristics. For example, afirst electrode 24 may be titanium nitride and contain Ti and metaloxide 22 may be a (doped or undoped) non-stoichiometric titanium oxidelayer which is nominally n-type. An electrode material with a workfunction less than the work function of the metal oxide will usuallyform an ohmic contact when the metal oxide behaves like an n-typematerial. Group IVB, VB, VIB, and VIIB metal nitrides generally form lowwork function compounds. Thus titanium nitride in contact with titaniumoxide forms a thermally stable ohmic contact. In the case when thenon-stoichiometric metal oxide is nominally p-type, then an electrodematerial with a work function less than the work function of the metaloxide will usually form a Schottky contact. Other examples of mostprevalent metals include but are not limited to zirconium, hafnium,vanadium, niobium, tantalum, chromium, molybdenum, and tungsten. Inaddition, generally, a metal nitride based on a metal located lower onthe periodic table will form a lower work function material than a metalnitride formed from a metal located higher on the periodic table.Therefore, in the example wherein the metal oxide is titanium oxidebased, a tantalum nitride electrode can also be used to achieve similarresults as titanium nitride.

Another advantage to forming metal oxide 22 from the same metal as theelectrode is that this can potentially eliminate the need to changeprocess chambers between the operations used to form the electrode andthe operations used to form metal oxide layer 22.

The interface that is formed between electrode 20 and metal oxide 22 maybe a Schottky contact or an ohmic contact. The interface that is formedbetween electrode 24 and metal oxide 22 may also be a Schottky contactor an ohmic contact. It is preferable that opposing electrodes formopposite contact types. With one suitable arrangement, electrode 24 andmetal oxide 22 form an ohmic contact (e.g., using a metal nitride forelectrode 24) and metal oxide 22 and electrode 20 form a Schottkycontact (e.g., using for example an optional adhesion layer and aworkfunction control layer for electrode 20). In the case of thetitanium-based n-type metal oxide example, electrode 24 is chosen to betitanium nitride to form an ohmic contact to the titanium-based n-typemetal oxide. Additionally, a high work function material such as Pt, Ir,IrO₂, etc. is chosen as the opposing electrode 20 to form a Schottkycontact (i.e., the work function of the electrode is greater than thework function of the n-type metal oxide). A thin adhesion/barrier layer,preferably less than or equal to about 50 angstroms, and more preferablyless than or equal to about 20 angstroms can be optionally used. Thethickness of the adhesion/barrier layer should be chosen such thatadhesion can be improved while not negatively impacting the workfunction controlling layer material.

Resistive switching memory element 12 exhibits a bistable resistance.When resistive switching memory element 12 is in a high resistancestate, it may be said to contain a logic one. When resistive switchingmemory element 12 is in a low resistance state, it may be said tocontain a logic zero. (If desired, high resistance can signify a logiczero and low resistance can signify a logic one.) The state of resistiveswitching memory element 12 may be sensed by application of a sensingvoltage. When it is desired to change the state of resistive switchingmemory element 12, read and write circuitry may apply suitable controlsignals to suitable lines 16 and 18.

By proper selection of the process parameters used to fabricate metaloxide 22, a resistive switching metal oxide may be formed that exhibitsa relatively large resistance. For example, metal oxide 22 in device 12may exhibit a high-state resistivity of at least one ohm-cm, at leastten ohm-cm, or at least 100 ohm-cm or more. The ratio of the high-stateresistance of element 12 to the low-state resistance of element 12 maybe greater than five or ten (as an example).

A current (I) versus voltage (V) plot for device 12 is shown in FIG. 3.Initially, device 12 may be in a high resistance state (e.g., storing alogic one). In this state, the current versus voltage characteristic ofdevice 12 is represented by solid line HRS 26. The high resistance stateof device 12 can be sensed by read and write circuitry associated withan array of devices 12. For example, read and write circuitry may applya read voltage V_(READ) to device 12 and can sense the resulting lowcurrent I_(L) that flows through device 12. When it is desired to storea logic zero in device 12, device 12 can be placed into itslow-resistance state. This may be accomplished by using read and writecircuitry to apply a voltage V_(SET) across terminals 16 and 18 ofdevice 12. Applying V_(SET) to device 12 causes device 12 to enter itslow resistance state, as indicated by dotted line 30. In this region,the structure of device 12 is changed (e.g., through the formation ofcurrent filaments through metal oxide 22 or other suitable mechanisms),so that, following removal of the voltage V_(SET), device 12 ischaracterized by low resistance curve LRS 28.

The low resistance state of device 12 can be sensed using the read andwrite circuitry. When a read voltage V_(READ) is applied to resistiveswitching memory element 12, the read and write circuitry will sense therelatively high current value I_(H), indicating that device 12 is in itslow resistance state. When it is desired to store a logic one in device12, device 12 can once again be placed in its high resistance state byapplying a voltage V_(RESET) to device 12. When the read and writecircuitry applies V_(RESET) to device 12, device 12 enters its highresistance state HRS, as indicated by dotted line 32. When the voltageV_(RESET) is removed from device 12, device 12 will once again becharacterized by high resistance line HRS 26.

The bistable resistance of resistive switching memory element 12 makesmemory element 12 suitable for storing digital data. Because no changestake place in the stored data in the absence of application of thevoltages V_(SET) and V_(RESET), memory formed from elements such aselement 12 is nonvolatile.

Any suitable read and write circuitry and array layout scheme may beused to construct a nonvolatile memory device from resistive switchingmemory elements such as element 12. For example, horizontal and verticallines 16 and 18 may be connected directly to the terminals of resistiveswitching memory elements 12. This is merely illustrative. If desired,other electrical devices may be associated with each element 12.

An example is shown in FIG. 4. As shown in FIG. 4, a diode 36 may beplaced in series with resistive switching memory element 12. Diode 36may be a Schottky diode, a p-n diode, a p-i-n diode, or any othersuitable diode.

If desired, other electrical components can be formed in series withresistive switching memory element 12. As shown in FIG. 5,series-connected electrical device 38 may be coupled to resistiveswitching memory element 12. Device 38 may be a diode, a transistor, orany other suitable electronic device. Because devices such as these canrectify or otherwise alter current flow, these devices are sometimesreferred to as rectifying elements or current steering elements. Asshown in FIG. 6, two electrical devices 38 may be placed in series witha resistive switching memory element 12. Electrical devices 38 may beformed as part of a nonvolatile memory element or may be formed asseparate devices at potentially remote locations relative to a resistiveswitching metal oxide and its associated electrodes.

Memory elements 12 may be fabricated in a single layer in array 10 ormay be fabricated in multiple layers forming a three-dimensional stack(with or without associated electrical devices 38). An advantage offorming memory arrays such as memory array 10 of FIG. 1 using amultilayer memory element scheme is that this type of approach allowsmemory element density to be maximized for a given chip size.

An illustrative integrated circuit 40 that contains multiple layers ofmemory elements is shown in FIG. 7. As shown in FIG. 7, integratedcircuit 40 has a substrate 44 (e.g., a silicon wafer). Multiple layers42 of resistive switching nonvolatile memory elements 12 have beenformed on substrate 44. In the example of FIG. 7, there are four layers42 on substrate 44. This is merely illustrative. There may be anysuitable number of layers of resistive switching memory elements 12 onan integrated circuit. Typically, each layer is laid out in across-point array similar to that depicted in FIG. 1.

Each layer 42 may contain identical memory elements 12 or some or all oflayers 42 may contain different types of memory elements. Consider, asan example, a situation in which a first layer of memory elements 12 isformed on substrate 44 and a second layer of memory elements 12 isformed on the first layer of memory elements. In this situation, thefirst layer of memory elements may have lower electrodes and metal oxidelayers in which the most prevalent metal is the same (e.g., titanium),whereas the second layer of memory elements may have lower electrodesand metal oxide layers in which the most prevalent metal is the same(e.g., hafnium), but in which the most prevalent metal is not the sameas the most prevalent metal in the first layer. If desired, the mostprevalent metal in the lower electrode and metal oxide layer of elements12 may be identical. For example, titanium may be used in the lowerelectrodes and metal oxide layers of all layers of elements 12 in astacked memory integrated circuit.

The layers of material that are formed when fabricating elements 12 maybe deposited using any suitable techniques. Illustrative depositiontechniques include physical vapor deposition (e.g., sputter depositionor evaporation), chemical vapor deposition, atomic layer deposition,electrochemical deposition (e.g., electroless deposition orelectroplating), ion implantation (e.g., ion implantation followed byannealing operations), thermal oxidation, etc.

A typical fabrication process is shown in FIG. 8. At step 46, one ormore optional layers are formed. For example, layers of material thatform underlying routing structures or lower layers of memory elements 12may be formed on a silicon wafer or other suitable substrate. Ifdesired, layers of material that form current steering elements such ascurrent steering elements 38 of FIG. 6 may be deposited.

At step 48, a first conductive layer such as conductive layer 24 ofFIGS. 2A and 2B may be formed. Conductive layer 24 may be formed onlower circuit layers. Conductive layer 24 may, as an example, be formedon an underlying line 18 on device 10 or may be formed as part of line18. Conductive layer 24 may be deposited on lower layer structures fromstep 46. For example, layer 24 may be deposited on a substrate, layersof nonvolatile memory elements (e.g., when the integrated circuit beingformed is a stacked memory device), conductive layers such as lines 18for routing, insulating layers for insulating conductive routing linesand nonvolatile memory elements from each other, or any other suitablelayers of material.

Layer 24 may be formed from metal, metal nitrides, metal silicides, orother suitable conductive materials. Layer 24 is preferably formed of ametal nitride of the form Me_(m)N_(n), where Me is a metal from groupIVB, VB, or VIB. Conductive layers of this type form stable conductiveinterfaces with subsequently deposited metal oxide layers and may allowfor good workfunction matching between conductive layer 24 and metaloxide layer 22 to form either ohmic or Schottky contacts depending onwhether the metal oxide subsequently formed is either n-type or p-typerespectively. The workfunction of metals from groups IVB, VB, and VIBtend to decrease as one moves down columns in the periodic table. Forexample, in group IVB, the workfunction of Ti is greater than theworkfunction of Zr, which is greater than the workfunction of Hf.Similarly, in group VB, the workfunction of V is greater than theworkfunction for Nb, which in turn is greater than the workfunction ofTa. This property allows materials to be selected for layer 24 that areappropriate for the resistive switching material being used.

It is often desirable to produce an electrode containing a metal thathas a workfunction that is less than the workfunction of the metal inits pure form. For example, to form an ohmic contact between anelectrode and an n-type metal oxide layer, it is desirable to use theelectrode that has workfunction that is less than the workfunction ofthe metal oxide. Because a nitride of a given metal will generally havea lower work function than a pure metal, it is desirable to form anelectrode from a nitride of a metal rather than from the metal itself.In addition, metal nitrides are generally more thermally stable thanpure metals. Examples of binary nitrides that may be formed at step 48include Ti_(m)N_(n), W_(m)N_(n), and Nb_(m)N_(n) (e.g., for use withTi_(x)O_(y), and W_(x)O_(y), and Nb_(x)O_(y) metal oxide layers).Ternary nitrides may also be formed (e.g., Ti_(x)Al_(y)N_(z),Nb_(x)Al_(y)N_(z), and W_(x)Al_(y)N_(z)) but should be chosen for thedesired work function.

Techniques that may be used to form layer 24 include physical vapordeposition (e.g., sputter deposition or evaporation), chemical vapordeposition, atomic layer deposition, and electrochemical deposition(e.g., electroless deposition or electroplating). If desired, more thanone material may be used to form conductive layer 24. For example,conductive layer 24 may be formed from multiple sublayers of differentmaterials or may be formed from a mixture of more than one element. Thecomposition of layer 24 may also be altered using doping (e.g., by usingion implantation to add dopant to a metal or other material). Thethickness of layer 24 may be in the range of 10-10000 angstroms (as anexample). Layer 24 may serve as a lower electrode for device 12.

After the conductive layer of step 48 has been formed, one or moreoptional layers may be formed at step 50. These layers may, as anexample, be used in forming electrical devices (current steeringelements) such as device 38 of FIG. 2B. During step 52, one or morelayers of semiconductor (e.g., doped and/or intrinsic silicon) may beformed and, if desired, one or more layers of conductor or othermaterials may be formed. If forming a diode, layers of n-type and p-typesilicon may be deposited. The layers of step 50 may be deposited onconductive layer 24 using any suitable technique (e.g., physical vapordeposition, chemical vapor deposition, atomic layer deposition, orelectrochemical deposition). Such electrical devices are optional andthe layers of this step do not need to be formed, particularly, if thesteering element is not interposed between the electrode and the metaloxide.

At step 52, metal oxide layer 22 may be deposited above the firstconductive layer. If no optional layers were formed at step 52, themetal oxide layer may be deposited directly on the first conductivelayer or may be formed by oxidizing the first conductive layer (e.g.,using thermal oxidation in a furnace, oxidation in a rapid thermaloxidation tool, or oxidation by ion implantation of oxygen ions followedby an annealing step). If the optional layers of step 50 were depositedon the first conductive layer, metal oxide layer 22 may be formed on theoptional layers, above the first conductive layer.

Metal oxide layer 22 may be formed of any suitable oxide. For example,metal oxide layer 22 may be formed from a transition metal such asnickel (i.e., to form nickel oxide). Other metals from which metal oxidemay be formed include Ti, V, Cr, Mn, Zr, Nb, Mo, Hf, Ta, and W. Dopantssuch as Ti, Co, Zr, V, Al, and Nb may be used in forming layer 22 (asexamples). Dopants may be introduced in any suitable concentration(e.g., an atomic concentration of 0-30%).

Metal oxide layer 22 may be formed from a non-stoichiometric materialMe_(x)O_(y), wherein Me is a metal from group IVB, VB, or VIB.Metal-rich metal oxides tend to form n-type semiconductors.Metal-deficient metal oxides tend to form p-type semiconductors.Nonstoichiometric metal oxides may exhibit better resistive switchingproperties than stoichiometric metal oxides. Particularly suitable metaloxides that may be formed at step 52 include Ti_(x)O_(y), Zr_(x)O_(y),Hf_(x)O_(y), V_(x)O_(y), Nb_(x)O_(y), Ta_(x)O_(y), Cr_(x)O_(y),Mo_(x)O_(y), and W_(x)O_(y) (as examples).

During step 52, metal oxide layer 22 may be deposited as a single layerof material or as multiple sublayers. In arrangements in which layer 22is formed of multiple sublayers, each sublayer may be formed by apotentially distinct fabrication process using a potentially distinctset of materials. For example, different sublayers in metal oxide layer22 may be formed at different deposition pressures, temperatures, andpower levels (e.g., different sputtering powers when layer 22 isdeposited using PVD techniques). Different sublayers in metal oxidelayer 22 may also be formed from different materials. For example, onesublayer may include dopant and another sublayer may not include dopant.If desired, the concentrations of the materials in layer 22 (e.g., themetal and/or the dopant) may be varied continuously, so that one layerruns into the next without any abrupt interfaces.

After forming metal oxide layer 22 at step 52, one or more optionallayers may be formed on the metal oxide layer 22 at step 54. Theselayers may, as an example, be used to form electrical devices (currentsteering elements) such as device 38 of FIG. 2B. During step 54, one ormore layers of semiconductor (e.g., doped and/or intrinsic silicon) maybe formed and, if desired, one or more layers of conductor or othermaterials may be formed. If forming a diode, layers of n-type and p-typesilicon may be deposited. The layers deposited during step 54 may bedeposited on metal oxide layer 22 using any suitable technique (e.g.,physical vapor deposition, chemical vapor deposition, atomic layerdeposition, or electrochemical deposition). Such electrical devices areoptional and this step does not need to be performed, particularly ifthe steering element is not interposed between the electrode and themetal oxide.

At step 56, a second conductive layer may be formed. For example, alayer of conductive material such as conductor 20 of FIGS. 2A and 2B maybe formed. If one or more of the optional layers of step 54 have beendeposited, the second conductive layer may be deposited on the optionallayers above the metal oxide layer 22 that was deposited at step 52. Ifnone of the optional layers of step 54 have been deposited, the secondconductive layer may be deposited above the metal oxide layer 22. Thesecond conductive layer may serve as an upper electrode for device 12.An ohmic contact or Schottky contact may be formed at the interfacebetween the second conductive layer and metal oxide layer 22.Preferably, the second conductive layer is chosen to be Schottky (ohmic)when the first conductive layer forms an ohmic (Schottky) contact to themetal oxide layer.

The second conductive layer may be formed from metals, metal nitrides(e.g., binary or ternary metal nitrides), metal silicides, or othersuitable conductive materials. High workfunction materials that may beused for forming a Schottky contact to (an n-type) metal oxide includePt, Ir, Ru, Rh, Re, Pd, Ti_(x)Al_(y)N_(z), Ta_(x)Al_(y)N_(z),W_(x)Al_(y)N_(z), IrO₂, and RuO₂. Techniques that may be used to formthe second conductive layer include physical vapor deposition (e.g.,sputter deposition or evaporation), chemical vapor deposition, atomiclayer deposition, and electrochemical deposition (e.g., electrolessdeposition or electroplating). If desired, more than one material may beused to form the second conductive layer. For example, conductive layer20 may be formed from multiple sublayers of different materials as shownin FIG. 2B or may be formed from a mixture of more than one element. Themost prevalent metal in the second conductive layer may be the same asor different than the most prevalent metal in the metal oxide and firstconductive layer. The second conductive layer may contain the mostprevalent metal of the metal oxide and the first conductive layer (e.g.,a metal nitride) in an atomic concentration of less than 10% (as anexample).

At step 58, one or more optional layers may be formed on the conductivelayer of step 56. For example, one or more layers of materials may bedeposited. These layers may, as an example, be used to form electricaldevices (current steering elements) such as devices 38 of FIG. 5 or FIG.6. During step 58, one or more layers of semiconductor (e.g., dopedand/or intrinsic silicon) may be formed and, if desired, one or morelayers of conductor or other materials may be formed. If forming adiode, layers of n-type and p-type silicon may be deposited. The layersdeposited during step 58 may be deposited on the second conductive layerusing any suitable technique (e.g., physical vapor deposition, chemicalvapor deposition, atomic layer deposition, or electrochemicaldeposition).

The foregoing is merely illustrative of the principles of this inventionand various modifications can be made by those skilled in the artwithout departing from the scope and spirit of the invention.

What is claimed is:
 1. A resistive switching nonvolatile memory elementcomprising: a first electrode; a second electrode; a layer of resistiveswitching nonstoichiometric metal oxide interposed between the first andsecond electrodes, wherein the first electrode and the resistiveswitching metal oxide contain a most prevalent metal that is the same;wherein the first electrode forms an ohmic contact with the metal oxideand wherein the second electrode forms a Schottky contact with the metaloxide.
 2. The resistive switching nonvolatile memory element defined inclaim 1, wherein the first electrode comprises a metal nitride.
 3. Theresistive switching nonvolatile memory element defined in claim 1wherein the metal oxide contains at least one dopant.
 4. The resistiveswitching nonvolatile memory element defined in claim 1 wherein the mostprevalent metal in the nonstoichiometric metal oxide comprises a metalselected from the group consisting of: a transition metal, Al, Ti, V,Cr, Mn, Zr, Nb, Mo, Hf, Ta, and W.
 5. The resistive switchingnonvolatile memory element defined in claim 1 wherein the secondelectrode comprises a material selected from the group consisting of Pt,Ir, Ru, Rh, Re, Pd, TixAlyNz, TaxAlyNz, WxAlyNz, IrO2, and RuO2.
 6. Theresistive switching nonvolatile memory element defined in claim 1,wherein the resistive switching nonvolatile memory element is formed onan integrated circuit that includes a current steering element andwherein at least one of: 1) the first electrode and 2) the secondelectrode is coupled in series with the current steering element.
 7. Theresistive switching nonvolatile memory element defined in claim 1,wherein the metal oxide layer is formed from multiple sublayers ofmaterial.
 8. The resistive switching nonvolatile memory element definedin claim 1, wherein the second electrode contains a most prevalent metaland wherein the most prevalent metal in the second electrode isdifferent than the most prevalent metal in the first electrode and themost prevalent metal in the metal oxide layer.
 9. The resistiveswitching nonvolatile memory element defined in claim 1 wherein thesecond electrode comprises at least first and second layers and whereinthe first layer comprises a layer selected from the group consisting of:an adhesion layer and a barrier layer.
 10. The resistive switchingnonvolatile memory element defined in claim 9 wherein the second layeris a workfunction control layer.
 11. The resistive switching nonvolatilememory element defined in claim 1 wherein one of the first electrode andthe second electrode comprises a noble material.